Browsing School of Microelectronic Engineering (Articles) by Subject "Stress (materials)"
Now showing items 1-2 of 2
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Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
(Emerald Group Publishing Limited, 2013)Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ... -
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)Purpose – The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...