Browsing School of Microelectronic Engineering (Articles) by Subject "Shear test"

Now showing items 1-4 of 4

    • Shear ram height investigation for gold wire bond shear test 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Taniselass, Steven; Ong, T.S. (Trans Tech Publications, 2012-12)
      This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...

    • Shear ram speed characterization for copper wire bond shear test 

      Zaliman, Sauli, Prof. Madya Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Wan Mokhzani, Wan Norhaimi; Taniselass, Steven; Abdul Halis, Abdul Aziz (Trans Tech Publications, Switzerland., 2012)
      This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...

    • Wire bond shear test simulation on hemispherical surface bond pad 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Wan Mokhzani, Wan Norhaimi; Johari, Adnan, Assc. Prof. Dr.; Palianysamy, Moganraj (Trans Tech Publications, 2012-12)
      Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...

    • Wire bond shear test simulation on sharp groove surface bond pad 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Vairavan, Rajendaran (Trans Tech Publications, 2012-12)
      Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...