Browsing School of Microelectronic Engineering (Articles) by Subject "Mechanical engineering"
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The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
(Elsevier Science, 2006)This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy ...