Browsing School of Microelectronic Engineering (Articles) by Subject "Integrated circuits"
Now showing items 1-2 of 2
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The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
(Science Publications, 2007)This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment ... -
Nano patterning of cone dots and nano constrictions of negative e-beam resist for single electron transistor fabrication
(Springer New York, 2007-12)We present an optimization of nano dot of negative tone e-beam resist which is a very important step in single electron transistor fabrication process. The optimum design of dot and nano constriction plays a significant ...