Browsing School of Microelectronic Engineering (Articles) by Subject "Aluminum bond pad"
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Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
(University of Malaya, 2008)In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ...