Browsing School of Microelectronic Engineering (Articles) by Subject "Aluminum"

Now showing items 1-4 of 4

    • The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition 

      Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim (American Society of Mechanical Engineers (ASME), 2006-09)
      This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...

    • Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Wei Wei, Ng (Trans Tech Publications, 2014)
      This paper presents the interaction relationships between Tetrafluoromethane (CF₄) gas, Oxygen (O₂) gas, and RF power in response to the surface roughness of an Aluminium deposited wafer after being etched using Reactive ...

    • Main effects study on plasma etched aluminium metallization 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow (Trans Tech Publications, 2014-01)
      Main effects contributing to the quality of surface roughness on an etched aluminium metallization wafer using Reactive Ion Etching (RIE) was studied. A total of three controllable process variables, with eight sets of ...

    • Surface roughness analysis on reactive ion etched aluminium deposited wafer 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow (Trans Tech Publications, 2014)
      This paper investigates the factors that affect the surface roughness on an Aluminium deposited wafer after reactive ion etching (RIE) using a combination of Tetrafluoromethane (CF₄) and Oxygen (O₂) gaseous. A total of ...