Browsing School of Microelectronic Engineering (Articles) by Author "Mohd Khairuddin, Md Arshad"
Now showing items 1-10 of 10
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Characteristics of Serial Peripheral Interfaces (SPI) timing parameters for optical mouse sensor
Mohd Khairuddin, Md Arshad; Uda, Hashim; Choo, C.M. (Institute of Electrical and Electronics Engineering (IEEE), 2006)In this paper we report the characterizations results of Serial Peripheral Interface (SPI) timing parameters for optical mouse sensor. SPI is an interface that facilitates the transfer of synchronous serial data. It supports ... -
The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar (Science Publications, 2007)This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment ... -
Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Mohammad Nuzaihan Md. Noor; Uda, Hashim (University of Malaya, 2008)In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ... -
Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad (Elsevier Science, 2007) -
The characterization of power supply noise for optical mouse sensor
Mohd Khairuddin, Md Arshad; Uda, Hashim; Ming, Choo Chew (Institute of Electrical and Electronics Engineering (IEEE), 2006)The induced power supply noise (sinusoidal waveform) that injected to Vdd pin will cause unwanted spike at the positive amplitude and negative amplitude to the DC input voltage. At certain limit this spike will cause the ... -
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim (American Society of Mechanical Engineers (ASME), 2006-09)This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ... -
FPGA based SPWM Bridge Inverter
Mohd Nazrin, Md Isa; Muhammad Imran, Ahmad; Sohiful Anuar, Zainol Murad; Mohd Khairuddin, Md Arshad (Science Publications, 2007)This study presents methodology to generate sinusoidal pulse width modulation (SPWM) signal using Field Programmable Gate Array, FPGA technology. We discussed the unipolar switching scheme and the methodology to generate ... -
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar (Elsevier Science, 2006)This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy ... -
The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
Mohd Khairuddin, Md Arshad; Mohd Nazrin, Md Isa; Sohiful Anuar, Zainol Murad (American Institute of Physics, 2007-05-09)This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond ... -
Ultra-thin body and thin-BOX SOI CMOS technology analog figures of merit
Kilchytska, Valeria I.; Mohd Khairuddin, Md Arshad; Makovejev, Sergej; Olsen, Sarah H.; Andrieu, Francois; Poiroux, Thierry; Faynot, Olivier; Raskin, Jean Pierre; Flandre, Denis (Elsevier Ltd., 2012-04)In this paper, we analyze, for the first time to our best knowledge, the perspectives of ultra-thin body and ultra-thin BOX (UTBB) SOI CMOS technology for analog applications. We show that UTBB is a promising contender ...