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Now showing items 31-40 of 54
Numerical analysis of velocity profile in a FFS microchannel
(AENSI Publisher All rights reserved, 2013-10)
Manipulation of the fluid flow behavior in microfluidic with precision technique is crucial to satisfy the needs of miniaturized systems. Velocity measurement is one of the physical phenomena plays significant role to ...
Complex background subtraction for biometric identification
(IEEE Conference Publications, 2007)
The background subtraction algorithm based on the YUV color space, image gradient and shape segmentation is used in this research to extract the region of interest from a real-time video surveillance camera. We choose to ...
Heat dissipation analysis under natural convection condition on high power LED
(AENSI Publisher All rights reserved, 2013-10)
As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ...
5mm × 5mm sized slug on high power LED stress and junction temperature analysis
(Trans Tech Publications (TTP), 2013)
Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder
(Trans Tech Publications (TTP), 2013)
Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...
Low density fibrous material surface light reflectance analysis
(AENSI Publisher All rights reserved, 2013-10)
The light based surface finishing of most product measurement is an important feature in the industries. In this paper, a lab fabricated tester for investigation on the quality of low density paper which was represent by ...
Wire bond shear test simulation
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)
Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...
FSS microchannel fluid flow profile investigation at high and low Re number
(AENSI Publisher All rights reserved, 2013-10)
The fundamental understanding of dynamic fluid flow behavior in different geometry channel is crucial due to transport phenomena influence on the key design and process control of the microfluidic systems. Recently, the ...
Microfluidic channel depth determination with Tywman-Green interferometer
(Springer-Verlag London., 2013-07)
A microfluidic channel is fabricated on a silica wafer using reactive ion etching (RIE). The depth of the microfluidic channel has been measured using a surface profilometer and a Twyman-Green interferometer (TGI) setup. ...
Shear ram speed characterization for copper wire bond shear test
(Trans Tech Publications, Switzerland., 2012)
This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...