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    Shear ram speed characterization for copper wire bond shear test

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    Shear ram speed characterization for copper wire bond shear test.pdf (25.24Kb)
    Date
    2012
    Author
    Zaliman, Sauli, Prof. Madya Dr.
    Retnasamy, Vithyacharan
    Ahmad Husni, Mohd Shapri
    Norazeani, Abdul Rahman
    Wan Mokhzani, Wan Norhaimi
    Taniselass, Steven
    Abdul Halis, Abdul Aziz
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    Abstract
    This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. The effects of the shear ram speed on the stress and strain response of the copper ball bond were investigated. A preliminary investigation confirms that shear ram speed has a significant effect on the von mises stress and equivalent strain response of the copper ball bond during wire bond shear test.
    URI
    http://www.scientific.net/AMM.229-231.670
    http://dspace.unimap.edu.my/123456789/26624
    Collections
    • School of Microelectronic Engineering (Articles) [183]
    • Steven Taniselass, Mr. [9]
    • Zaliman Sauli, Lt. Kol. Professor Dr. [55]
    • Vithyacharan Retnasamy [54]

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