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Fabrication of Amorphous silicon Microgap Structure for Energy Saving Devices
(Universiti Kebangsaan Malaysia, 2011-11-18)
We report here the fabrication of microgaps electrodes on amorphous silicon using low cost techniques such as vacuum deposition and conventional lithography. Amorphous silicon is a low cost material and has desirable ...
Design and fabrication of Nanowire-based conductance biosensor using spacer patterning technique
(Institute of Electrical and Electronics Engineering (IEEE), 2008-12-01)
Materials have different behaviours and properties at the nanoscales (1-100nm). New theories and discoveries have been found in designing and fabricating at these sizes. Silicon Nanowires has allowed the introduction of ...
Investigation of the absorption coefficient, refractive index, energy band gap, and film thickness for Al0.11Ga0.89N, Al0.03Ga0.97N, and GaN by optical transmission method
(Universiti Malaysia Perlis, 2009)
The design of optoelectronic devices fabricated from III-Nitride materials is aided by knowledge of refractive index and absorption coefficient of these materials .The optical properties of Al0.11Ga0.89N, Al0.03Ga0.97N, ...
A systematic dry etching process for profile control of quantum dots and nanoconstrictions
(Elsevier B.V., 2007-08)
In essence, quantum dot dimensions and others can be laterally and vertically defined by using either bottom up or top down methods respectively. In fabrication that uses top down method, etch process hold a chief role. ...
Single-Electron Transistors (SET): literature review
(Kolej Universiti Kejuruteraan Utara Malaysia, 2005)
Single-electron transistor (SET) is a key element in our research field where device operation is based on one-by-one electron through the channel utilizing the Coulomb blockade effect. The SET are often discussed as ...
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)
This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...
Simulasi Fabrikasi Simpangan Cetek Ultra menggunakan Resapan Dopan daripada SOD (Spin On Dopant)
(Universiti Malaysia Perlis, 2006)
Pembentukan simpangan cetek ultra merupakan suatu proses yang kritikal dalam fabrikasi peranti-peranti submikron bagi teknologi litar terkamil pada masa hadapan. Di dalam penulisan ini, simulasi proses pembentukan simpangan ...
Cost Effective Negative Plenum Cleanroom for Microelectronic Engineering undergraduate
(Kolej Universiti Kejuruteraan Utara Malaysia, 2005)
The Negative Plenum Cleanroom which is design and built by KUKUM is primarily used for the teaching of the undergraduate microelectronic course. The cleanroom is approximately 115m² in size. The level of cleanliness in the ...
Nanotechnology development in Malaysia: current status and implementation strategy
(Universiti Malaysia Perlis, 2008-12-05)
Nano-technology development needs all the support it could get to ensure the technology is being leveled up and benefits all mankind. Malaysia has started it own
micro-technology and nano-technology development since the ...
The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
(Universiti Putra Malaysia (UPM), 2005-12-06)
The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure ...