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The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)
This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...
The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
(Universiti Putra Malaysia (UPM), 2005-12-06)
The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure ...
Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad
(The Electrochemical Society, 2009-03-17)
This paper presents the study of the thermal aging of the gold ball bonds and aluminum bond pad at 150 °C and 200 °C for various interval times. Process decapsulation and Field Emission Scanning Electron Microscopy (FESEM) ...
The characterization of power supply noise for optical mouse sensor
(Institute of Electrical and Electronics Engineering (IEEE), 2006)
The induced power supply noise (sinusoidal waveform) that injected to Vdd pin will cause unwanted spike at the positive amplitude and negative amplitude to the DC input voltage. At certain limit this spike will cause the ...
Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
(University of Malaya, 2008)
In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ...
Characteristics of Serial Peripheral Interfaces (SPI) timing parameters for optical mouse sensor
(Institute of Electrical and Electronics Engineering (IEEE), 2006)
In this paper we report the characterizations results of Serial Peripheral Interface (SPI) timing parameters for optical mouse sensor. SPI is an interface that facilitates the transfer of synchronous serial data. It supports ...
The Impacts of Platinum Diffusion to the Reverse Recovery Lifetime of a High Power Diode Devices
(EDP Sciences, 2016)
The reverse recovery lifetime of a diode is one the key parameter in power electronics market. To make a diode with fast switching speed, diodes are often doped with impurities such as gold and platinum to improve its ...
Biotechnological processes in microbial Amylase production
(Hindawi Limited, 2017-02-09)
Amylase is an important and indispensable enzyme that plays a pivotal role in the field of biotechnology. It is produced mainly
from microbial sources and is used in many industries. Industrial sectors with top-down and ...