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Browsing by Author Noraniza, Saud

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Issue DateTitleAuthor(s)
2013Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solderMohd Arif Anuar, Mohd Salleh; Noraniza, Saud; Najib Saedi, Ibrahim; arifanuar@unimap.edu.my
2013Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrateMohd Arif Anuar, Mohd Salleh; Noraniza, Saud; Najib Saedi, Ibrahim; arifanuar@unimap.edu.my
17-Apr-2015SAC-SIC : a new potential lead–free composite solder for green technologyZawawi, Mahim; Sayyidah Amnah, Musa; Noraniza, Saud; Nurul Razliana, Abdul Razak
Showing results 1 to 3 of 3