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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/34876
Title: Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
Authors: Mohd Arif Anuar, Mohd Salleh
Noraniza, Saud
Najib Saedi, Ibrahim
arifanuar@unimap.edu.my
Keywords: Composite
Growth kinetics
Intermetallic
Issue Date: 2013
Publisher: Trans Tech Publications
Citation: Advanced Materials Research, vol.795, 2013, pages 505-508
Abstract: The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its interfacial joint on Cu substrate. Various isothermal of aging times were carried in this study by using 24hrs, 240hrs, 480hrs, 600hrs and 720hrs at 150°C of aging temperature. The Cu-Sn IMC thickness was increase with increasing aging time and the diffusion coefficient of this composite solder is 1.16x10-16m2/s.
Description: Link to publisher's homepage at http://www.scientific.net/
URI: http://www.scientific.net/AMR.795.505
http://dspace.unimap.edu.my:80/dspace/handle/123456789/34876
ISSN: 1662-8985
Appears in Collections:Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.

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