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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/34876
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dc.contributor.authorMohd Arif Anuar, Mohd Salleh-
dc.contributor.authorNoraniza, Saud-
dc.contributor.authorNajib Saedi, Ibrahim-
dc.date.accessioned2014-05-29T08:43:22Z-
dc.date.available2014-05-29T08:43:22Z-
dc.date.issued2013-
dc.identifier.citationAdvanced Materials Research, vol.795, 2013, pages 505-508en_US
dc.identifier.issn1662-8985-
dc.identifier.urihttp://www.scientific.net/AMR.795.505-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34876-
dc.descriptionLink to publisher's homepage at http://www.scientific.net/en_US
dc.description.abstractThe effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its interfacial joint on Cu substrate. Various isothermal of aging times were carried in this study by using 24hrs, 240hrs, 480hrs, 600hrs and 720hrs at 150°C of aging temperature. The Cu-Sn IMC thickness was increase with increasing aging time and the diffusion coefficient of this composite solder is 1.16x10-16m2/s.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectCompositeen_US
dc.subjectGrowth kineticsen_US
dc.subjectIntermetallicen_US
dc.titleEffect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrateen_US
dc.typeArticleen_US
dc.identifier.url10.4028/www.scientific.net/AMR.795.505-
dc.contributor.urlarifanuar@unimap.edu.myen_US
Appears in Collections:Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.

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