UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Statistics
Total Visits
| Views | |
|---|---|
| Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate | 149 |
Total Visits per Month
| May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | October 2025 | November 2025 | |
|---|---|---|---|---|---|---|---|
| Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate | 3 | 1 | 3 | 3 | 8 | 3 | 5 |
File Downloads
| Views | |
|---|---|
| Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-07Cu-Si3N4 composite solder on copper substrate.pdf | 41 |
Top Country Views
| Views | |
|---|---|
| United States | 78 |
| Ireland | 9 |
| China | 7 |
| Brazil | 6 |
| Australia | 4 |
| Japan | 4 |
| Singapore | 4 |
| Vietnam | 4 |
| Germany | 3 |
| Malaysia | 3 |
Top City Views
| Views | |
|---|---|
| San Mateo | 18 |
| Dublin | 9 |
| Boardman | 5 |
| Ashburn | 4 |
| Andover | 3 |
| Hangzhou | 3 |
| Hanoi | 3 |
| Seattle | 3 |
| Brisbane | 2 |
| Columbus | 2 |