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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/34873| Title: | Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder |
| Authors: | Mohd Arif Anuar, Mohd Salleh Noraniza, Saud Najib Saedi, Ibrahim arifanuar@unimap.edu.my |
| Keywords: | Aging Composite Intermetallic |
| Issue Date: | 2013 |
| Publisher: | Trans Tech Publications |
| Citation: | Advanced Materials Research, vol.795, 2013, pages 522-525 |
| Abstract: | Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature. |
| Description: | Link to publisher's homepage at http://www.scientific.net/ |
| URI: | http://www.scientific.net/AMR.795.522 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34873 |
| ISSN: | 1662-8985 |
| Appears in Collections: | Kahtan Sadiq Muhammed, Dr. |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Effect of aging temperature on the intermetallic compound IMC formation of Sn-07CuSi3N4 composite solder.pdf | 125.97 kB | Adobe PDF | View/Open |
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