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dc.contributor.authorMohd Arif Anuar, Mohd Salleh-
dc.contributor.authorNoraniza, Saud-
dc.contributor.authorNajib Saedi, Ibrahim-
dc.date.accessioned2014-05-29T08:19:50Z-
dc.date.available2014-05-29T08:19:50Z-
dc.date.issued2013-
dc.identifier.citationAdvanced Materials Research, vol.795, 2013, pages 522-525en_US
dc.identifier.issn1662-8985-
dc.identifier.urihttp://www.scientific.net/AMR.795.522-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34873-
dc.descriptionLink to publisher's homepage at http://www.scientific.net/en_US
dc.description.abstractNowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectAgingen_US
dc.subjectCompositeen_US
dc.subjectIntermetallicen_US
dc.titleEffect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solderen_US
dc.typeArticleen_US
dc.identifier.url10.4028/www.scientific.net/AMR.795.522-
dc.contributor.urlarifanuar@unimap.edu.myen_US
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