SAC-SIC : a new potential lead–free composite solder for green technology

Abstract

Recently, the development of Sn-Ag-Cu (SAC) has gain attention in electronic packaging industry due to its good reliability in the electronics application. The tin-silver-copper family of alloys has earned a great deal of positive response from various industry consortia and organizations in resend year and the majority of manufacturers plan on implementing one of these alloys. However, as there are several different alloy formulation within the tin-silver-copper family, background information is necessary to determine which alloy is best suited for the broadest range of applications. Literature has shown that, an attractive and potentially viable method of enhancing the performance of a solder in terms of mechanical and thermal properties is by adding reinforcements to a conventional solder alloy, forming a composite solder. The presence of the second phases such as ceramic reinforcements has been proposed as the potential mechanism controlling reliability of the solder joints, SAC added with SiC particles as reinforcement to developed “ A New Potential Lead-Free Composite Solder For Green Technology” to enhance the physical and mechanical properties of the solder joint. The melting point of this composite solder were slightly increase which will not effect the processing flow in the industry. This superior lead-free composite solder was improved the solderability and mechanical properties compared to current commercial solder of SAC lead-free solder.