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| Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA) | 147 |
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| January 2024 | February 2024 | March 2024 | April 2024 | May 2024 | June 2024 | July 2024 | |
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| Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA) | 9 | 3 | 4 | 3 | 3 | 11 | 0 |
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