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Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging | 122 |
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Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging | 6 | 5 | 3 | 6 | 4 | 2 | 0 |
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Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging.pdf | 57 |
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