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Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity
(Universiti Malaysia Perlis (UniMAP), 2022-03)
The thermal conductivities of a multilayer model of GNP/Ag hybrid die-attach material are
explored using steady-state thermal modeling. The heat flux in multilayer GNP/Ag hybrid
structures is shown to be highly layer ...
Analyse of strain and stress on different stretchable conductive ink materials by numerical method
(Universiti Malaysia Perlis (UniMAP), 2022-03)
This study determines the optimal stretchability performance of different materials on a
conductive pattern by using maximum principal elastic strain and Von Mises stress analysis.
It was performed by using finite element ...