Now showing items 1-2 of 2

    • Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity 

      Ameeruz Kamal, Ab Wahid; Mohd Azli, Salim; Nor Azmmi, Masripan; Chonlatee, Photong; Adzni, Md. Saad; Mohd Zaid, Akop; Muhd Ridzuan, Mansor (Universiti Malaysia Perlis (UniMAP), 2022-03)
      The thermal conductivities of a multilayer model of GNP/Ag hybrid die-attach material are explored using steady-state thermal modeling. The heat flux in multilayer GNP/Ag hybrid structures is shown to be highly layer ...
    • A study of steady-state thermal distribution on circular plate using ANSYS 

      F. Jikol; M. Z. Akop; Y. M. Arifin; M. A. Salim; S. G. Herawan (Universiti Malaysia Perlis (UniMAP), 2021-08)
      The purpose of this study is to investigate the thermal behavior of a circular-shaped hot plate when certain thermal load is applied. The hot plate is a part of hot surface deposition test equipment, and is placed on top ...