Browsing International Journal of Nanoelectronics and Materials (IJNeaM) by Subject "Sintered Ag"

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    • Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology 

      Siti Rahmah, Esa; Genesia, Omar; Siti Hajar, Sheikh Md Fadzullah; Kim, S. Siow; B. Abdul Rahim; B. Çoşut (Universiti Malaysia Perlis (UniMAP), 2020-05)
      Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ...

    • The evolutions of microstructure in pressureless Sintered Silver die attach material 

      S.R., Esa; G., Omar; S.H. Sheikh, Md Fadzullah; K.S Siow; B., Abdul Rahim (Universiti Malaysia Perlis (UniMAP), 2021-04)
      Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure ...