Browsing International Journal of Nanoelectronics and Materials (IJNeaM) by Subject "Pre-plated leadframe"
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Correlation between surface texturing on pre-plated leadframe and delamination phenomenon in automotive packaging
(Universiti Malaysia Perlis (UniMAP), 2022-07)Poor adhesion between mold compound and leadframe in integrated circuit packaging for automotive devices can cause serious reliability issue and degrade the package quality. This study aims to evaluate and understand the ...