Browsing International Journal of Nanoelectronics and Materials (IJNeaM) by Subject "Mechanism"
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Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
(Universiti Malaysia Perlis (UniMAP), 2020-05)Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ...