Browsing International Journal of Nanoelectronics and Materials (IJNeaM) by Author "ghazali@utem.edu.my"

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Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

Siti Rahmah, Esa; Genesia, Omar; Siti Hajar, Sheikh Md Fadzullah; Kim, S. Siow; B. Abdul Rahim; B. Çoşut (Universiti Malaysia Perlis (UniMAP), 2020-05)

Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ...
The effect of temperature on the electrical conductivity and microstructure behaviour of silver particles

A. M., Yunos; G., Omar; M. A, Salim; N. A., Masripan; Mohammed Hussin Ahmed Al-Mola (Universiti Malaysia Perlis (UniMAP), 2020-05)

Silver conductive ink has been used in the electronics industry due to their potential advantages such as high electrical conductivity and thermal conductivity. However, silver needs to undergo a curing process to reduce ...
Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

A. S., Ashikin; G., Omar; N., Tamaldin; S., Jasmee; H. A., Hamid; A., Jalar; F., Che Ani (Universiti Malaysia Perlis (UniMAP), 2020-05)

Emerging of conductive metal filler in nanoscale like Silver-Filled Conductive Polymer Composite (SFCP) ink is one of the important technology for electronic interconnects future. Among the key challenges in the successful ...