Browsing International Journal of Nanoelectronics and Materials (IJNeaM) by Author "N., Tamaldin"
Now showing items 1-2 of 2
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Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
A. S., Ashikin; G., Omar; N., Tamaldin; S., Jasmee; H. A., Hamid; A., Jalar; F., Che Ani (Universiti Malaysia Perlis (UniMAP), 2020-05)Emerging of conductive metal filler in nanoscale like Silver-Filled Conductive Polymer Composite (SFCP) ink is one of the important technology for electronic interconnects future. Among the key challenges in the successful ... -
Three-dimensional uniaxially aligned nanofibre construct using secondary electrode assisted gap electrospinning
A. H., Nurfaizey; M. A., Salim; N., Tamaldin; R., Nadlene; A. A., Kamarolzaman; N., Tucker (Universiti Malaysia Perlis (UniMAP), 2020-05)Electrospinning is a simple, versatile, and scalable method of producing polymeric nanofibres from a solution or melt using electric charge. Due to their nanometre-scale diameters, electrospun fibres have been the subject ...