Now showing items 1-2 of 2

    • Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology 

      Siti Rahmah, Esa; Genesia, Omar; Siti Hajar, Sheikh Md Fadzullah; Kim, S. Siow; B. Abdul Rahim; B. Çoşut (Universiti Malaysia Perlis (UniMAP), 2020-05)
      Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ...
    • Theoretical demonstration of elastic wave guiding in a Pillar-Based phononic crystal slab 

      Mohd Syafiq, Faiz; Kim, S. Siow; Wee, MF Mohd Razip; Muhammad Musoddiq, Jaafar; Burhanuddin, Yeop Majlis; Ahmad Rifqi, Md. Zain (Universiti Malaysia Perlis (UniMAP), 2020-12)
      We demonstrated theoretically the wave guiding of elastics waves in a two-dimensional (2D) phononic crystal (PnC) slab. The simulation model based on the Finite Element Method (FEM) was used to calculate the dispersion ...