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dc.contributor.authorUda, Hashim
dc.contributor.authorRamzan, Mat Ayub
dc.contributor.authorNik Hazura, Nik Hamat
dc.date.accessioned2009-08-13T08:53:44Z
dc.date.available2009-08-13T08:53:44Z
dc.date.issued2007
dc.identifier.citationSains Malaysiana, vol.36 (1), 2007, pages 53-57.en_US
dc.identifier.issn0126-6039
dc.identifier.urihttp://pkukmweb.ukm.my/~jsm/
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/6889
dc.descriptionLink to publisher's homepage at http://pkukmweb.ukm.my/~jsm/en_US
dc.description.abstractThis paper involves the planarization of borophosphosilicate glass (BPSG) film using a new recipe for annealing process to improve the borophosphosilicate glass (BPSG) film flatness after reflow. This improvement is for 0.35μm technology using steam annealing method at different temperatures. This process allows the planarization of wafers with thin layer at its surface. In this paper we present the comparison between the effect of hydrofluoric acid (HF) staining on the cross sectional topography with the samples without hydrofluoric acid (HF) staining analyzed by field emission scanning electron microscopy (FESEM). We found that staining with HF produced clearer images.en_US
dc.language.isoenen_US
dc.publisherUniversiti Kebangsaan Malaysiaen_US
dc.subjectBorophosphosilicate glassen_US
dc.subjectHydrofluoric acid stainingen_US
dc.subjectSteam annealingen_US
dc.subjectMicroelectronics -- Materialsen_US
dc.subjectIntegrated circuits -- Materialsen_US
dc.subjectMetal oxide semiconductors, Complementaryen_US
dc.titleBorophosphosilicate glass (BPSG) reflow characterization for submicron CMOS technologyen_US
dc.typeArticleen_US


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