Vithyacharan Retnasamy: Recent submissions
Now showing items 41-54 of 54
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Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ... -
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ... -
Shear ram height investigation for gold wire bond shear test
(Trans Tech Publications, 2012-12)This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ... -
Wire bond shear test simulation on hemispherical surface bond pad
(Trans Tech Publications, 2012-12)Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ... -
Simulation and characterization of MEMS piezoelectric thermal actuator
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)The development of low cost MEMS devices has been the main focus in recent years. This leads to discovery of MEMS materials and suitable devices. Magnetostatic and electrostatic actuators produce relatively small forces; ... -
Wire bond shear test simulation
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ... -
Silica microchannel fabrication using fluorine based rie with alas a mask
(INSInet Publications, 2012-09)The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ... -
Shear ram speed characterization for copper wire bond shear test
(Trans Tech Publications, Switzerland., 2012)This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ... -
Microfluidic channel depth determination with Tywman-Green interferometer
(Springer-Verlag London., 2013-07)A microfluidic channel is fabricated on a silica wafer using reactive ion etching (RIE). The depth of the microfluidic channel has been measured using a surface profilometer and a Twyman-Green interferometer (TGI) setup. ... -
Micro-reservoir depth determination with Twyman-Green Interferometer
(Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)A micro-reservoir is fabricated on transparent silica wafer using Reactive Ion Etching (RIE). The depth of the micro-reservoir has been measured using profilometer, Atomic Force Microscopy (AFM) and Twyman Green-Interferometer. ... -
Velocity profiles and friction factor analysis of liquid flow in microstructured microchannel
(Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)In this work, simulations were performed for the flow of water through rough microchannel taking into consideration a pressure-driven flow. Analysis on pressure drop, friction factor and velocity profile have been investigated ... -
Microchannel miter bend effects on pressure equalization and vortex formation
(Springer-Verlag, 2011)Simulations have been carried out for water flow in a square microchannel with a miter bend. The simulation considered a pressure-driven flow in a channel-hydraulic diameter of 5 μm for series of Reynolds number (Re) range ... -
Phase-map fringe pixel tracing for height computation
(Institute of Electrical and Electronics of Engineering (IEEE), 2010-10-03)Fringe projection coupled with phase map generation has been used extensively for various applications namely in quality control sector of the industrial field. A phase map is generated from a multiple fringe projected ... -
Heart Caring "Handy" - Prototype
(Malaysian Invention and Design Society (MINDS), 2006-05-19)"Heart Carrying Handy" is designed to detect early abnormality in the heart pulse which will be deemed as a pre-heart attack sympton.