Zaliman Sauli, Lt. Kol. Professor Dr.: Recent submissions
Now showing items 41-55 of 55
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Velocity profile investigation of FFS microchannel at Re 100
(Trans Tech Publications, 2014)Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different ... -
Fibrous material surface reflectance analysis
(Trans Tech Publications, 2014)The light inspection on surface finishing of most product measurement is an important feature in the industries. In this study, a lab module tester for examination on the different type quality of tissue paper quality was ... -
Physical characterization of BST with different (x') ratios
(Trans Tech Publications, 2014)Nowdays Barium strontium titanate (BST) can be applied into many fields of engineering. Its properties attracted more researchers to research and apply it into many fields of study. In this work, sol-gel method of preparing ... -
3D shape measurement and reconstruction using fringe projection
(Trans Tech Publications, 2014)Digital fringe projection technique using phase shifting method has been studied extensively for generatingthree dimensional (3D) surface information. The aim of this paper is to develop a simple automated optical inspection ... -
A comparative analysis between logarithmic number system and floating-point ALU
(AENSI Publisher All rights reserved, 2013-10)The ease and accuracy of executing the multiplication and division operations by using either fixed-point addition or subtraction is what makes the logarithmic number system an attractive option. However, its main drawback ... -
Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ... -
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ... -
Shear ram height investigation for gold wire bond shear test
(Trans Tech Publications, 2012-12)This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ... -
Wire bond shear test simulation on hemispherical surface bond pad
(Trans Tech Publications, 2012-12)Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ... -
Symmetry energy of nuclear matter at low densities and clustering at the nuclear surface
(IOP Publishing Ltd, 2012)We present a density functional theory which connects nuclear matter equation of state, which incorporates clustering at low densities, with clustering in medium and heavy nuclei at the nuclear surface. This explains the ... -
Wire bond shear test simulation
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ... -
Silica microchannel fabrication using fluorine based rie with alas a mask
(INSInet Publications, 2012-09)The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ... -
Shear ram speed characterization for copper wire bond shear test
(Trans Tech Publications, Switzerland., 2012)This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ... -
Design and analysis of film bulk acoustic wave resonator in Ku-band frequency for wireless communication
(Society of Photo-Optical Instrumentation Engineers (SPIE), 2012-03-12)This paper presents design of a Film Bulk Acoustic Wave Resonators (FBARs) consisting of piezoelectric film, aluminium nitride (AlN) with top and bottom electrodes of ruthenium (Ru). The lumped Butterworth-Van Dyke (BVD) ... -
Microfluidic channel depth determination with Tywman-Green interferometer
(Springer-Verlag London., 2013-07)A microfluidic channel is fabricated on a silica wafer using reactive ion etching (RIE). The depth of the microfluidic channel has been measured using a surface profilometer and a Twyman-Green interferometer (TGI) setup. ...