Zaliman Sauli, Lt. Kol. Professor Dr.: Recent submissions

Now showing items 21-40 of 55

    • Design and analysis of wideband ladder-type film bulk acoustic wave resonator filters in Ku-band 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Hindawi Publishing Corporation, 2013)
      This paper presents the design of ladder-type filters based on film bulk acoustic wave resonator (FBAR) in Ku-band. The proposed FBAR filter has an insertion loss of -3 dB, out-of-band rejection of -12 dB and 3 dB bandwidth ...

    • Design and simulation of film bulk acoustic wave resonator in kuband 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Trans Tech Publications, 2013)
      This paper presents the design of a Film Bulk Acoustic Wave Resonators (FBARs) operating in Ku-band. The one-dimensional (1-D) numerical and the three-dimension (3-D) Finite Element Method (FEM) simulation results are ...

    • Film bulk acoustic wave resonator filter for Ku-band applications 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Trans Tech Publications (TTP), 2013)
      The design and analysis of Ku-band ladder-type filters based on film bulk acoustic wave resonator (FBAR) is presented. The proposed FBAR filter has an insertion loss of -3dB, out-of-band rejection of -12dB, centre frequency ...

    • Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Foong, Chee Seng; Tan, Chou Yong, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ...

    • Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...

    • Surface roughness and wettability correlation on etched platinum using reactive ion ecthing 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Goh, Siew Chui; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
      As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated ...

    • Natural heat convection analysis on cylindrical Al slug of LED 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah; Nazuhusna, Khalid (Trans Tech Publications, 2014-01)
      This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...

    • Main effects study on plasma etched aluminium metallization 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow (Trans Tech Publications, 2014-01)
      Main effects contributing to the quality of surface roughness on an etched aluminium metallization wafer using Reactive Ion Etching (RIE) was studied. A total of three controllable process variables, with eight sets of ...

    • BaₓSr₁-ₓ TiO₃ different thickness analysis using sol gel approach 

      Nurhafizah, Ramli; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; They, Yee Chin; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
      Barium Strontium Titanate (BST) a common topic in the microelectronic field for many devices which is mainly on dynamic random access memories (DRAM). There are many methods of preparing BaₓSr₁-ₓTiO3; barium strontium ...

    • Operating temperature analysis of LED with cylindrical Cu slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      High power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This ...

    • CuDia slug size variation analysis on heat dissipation of high power LED 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr. (Trans Tech Publications, 2014-01)
      The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation ...

    • Heat sink fin number variation analysis on single chip high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ...

    • WSS investigation in microfluidic FFS channel at Re 500 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Nor Shakirina, Nadzri; Hsio Mei, Tan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
      Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...

    • Fibrous material density difference analysis using light reflectance 

      Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      The objective of this work is designed and fabricated a lab module tester to differentiate the different type of printing paper quality which available commercially was done. Laser light source was used to differentiate ...

    • Analysis on surface roughness and surface reflectance through DOE 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ong, Tee Say (Trans Tech Publications, 2014)
      The Lambda 950 spectrometers are designed to investigate and examine surface coating on test specimen by using the light source. The objective of this research is to investigate the factors that affect the surface roughness ...

    • Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Wei Wei, Ng (Trans Tech Publications, 2014)
      This paper presents the interaction relationships between Tetrafluoromethane (CF₄) gas, Oxygen (O₂) gas, and RF power in response to the surface roughness of an Aluminium deposited wafer after being etched using Reactive ...

    • Height measurement based on fringe projection 

      Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Nor Shakirina, Nadzri; Veriven, Christopher John (Trans Tech Publications, 2014)
      A three-dimensional surface measurement using fringe projection technique has received attention among the researches for the last few decades.However choosing the best method is the challenge because one needs to consider ...

    • Surface roughness analysis on reactive ion etched aluminium deposited wafer 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow (Trans Tech Publications, 2014)
      This paper investigates the factors that affect the surface roughness on an Aluminium deposited wafer after reactive ion etching (RIE) using a combination of Tetrafluoromethane (CF₄) and Oxygen (O₂) gaseous. A total of ...

    • Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Siew Chui, Goh; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ...

    • Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Siew Chui, Goh; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ...