Now showing items 1-5 of 5

    • Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication 

      Muhamad Hafiz, Zan @ Hazizi; Mohd Arif Anuar, Mohd Salleh; Zainal Arifin, Ahmad, Prof.; Mohd Mustafa Al-Bakri, Abdullah; Alida, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (Trans Tech Publications, 2013)
      The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
    • Compressive strength of fly ash based geopolymer / glass fiber composite via filament winding 

      Che Mohd Ruzaidi, Ghazali, Prof. Madya; Alida, Abdullah; Mohd Mustafa Al Bakri, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Anis Nadhirah, Ismail (Trans Tech Publications, 2014)
      In general, filament winding technique is used to fabricate the composite pipes using continuous fiber and matrix resin. In this study, fly ash based geopolymer resin composites reinforced by continuous glass fiber were ...
    • Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder 

      Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al-Bakri, Abdullah; Muhammad Hafiz, Zan Hazizi; Flora, Somidin; Noor Farhani, Mohd Alui; Zainal Arifin, Ahmad, Prof. (Elsevier B.V., 2012-10)
      The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of ...
    • Research advances of composite solder material fabricated via powder metallurgy route 

      Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
    • Research development of solder materials and its intermetallic compound (IMC) study 

      Mohd Arif Anuar, Mohd Salleh; Najib Saedi, Ibrahim; Saud, N.; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...