Show simple item record

dc.contributor.authorZaliman, Sauli, Dr.
dc.contributor.authorRetnasamy, Vithyacharan
dc.contributor.authorFairul Afzal, Ahmad Fuad
dc.contributor.authorEhkan, Phaklen, Dr.
dc.contributor.authorOng, Tee Say
dc.contributor.authorVairavan, Rajendaran
dc.date.accessioned2014-06-11T08:52:20Z
dc.date.available2014-06-11T08:52:20Z
dc.date.issued2013
dc.identifier.citationApplied Mechanics and Materials, vol. 404, 2013, pages 72-76en_US
dc.identifier.isbn978-303785845-5
dc.identifier.issn1660-9336
dc.identifier.urihttp://www.scientific.net/AMM.404.72
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35387
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractBall Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. Hence, this leads to the study of stress on the BGA. This paper discussed the load effects of varying shear speed analysis on the BGA. A Pb-free material, Sn-3.9Ag-0.6Cu solder was applied in the simulation. Shear height value is fixed while the shear speed is varied to investigate the dynamic stress on a BGA package using Ansys software. The results from the graph plotted showed that higher shear speed results to higher shear force.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publications (TTP)en_US
dc.subjectAnsysen_US
dc.subjectBall grid array (BGA)en_US
dc.subjectShear speeden_US
dc.subjectStressen_US
dc.titleShear speed analysis on Sn-3.9Ag-0.6Cu Solderen_US
dc.typeArticleen_US
dc.contributor.urlzaliman@unimap.edu.myen_US
dc.contributor.urlvc.sundress@gmail.comen_US
dc.contributor.urlfairul@unimap.edu.myen_US
dc.contributor.urlphaklen@unimap.edu.myen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record