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dc.contributor.authorZaliman, Sauli, Dr.
dc.contributor.authorRetnasamy, Vithyacharan
dc.contributor.authorFairul Afzal, Ahmad Fuad
dc.contributor.authorEhkan, Phaklen, Dr.
dc.contributor.authorPalianysamy, Moganraj
dc.contributor.authorAaron, Koay Terr Yeow
dc.date.accessioned2014-06-11T07:45:23Z
dc.date.available2014-06-11T07:45:23Z
dc.date.issued2013
dc.identifier.citationApplied Mechanics and Materials, vol. 404, 2013, pages 67-71en_US
dc.identifier.isbn978-303785845-5
dc.identifier.issn1660-9336
dc.identifier.urihttp://www.scientific.net/AMM.404.67
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35370
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractReactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. RIE parameters are varied to obtain 16 different recipes which are done using Design of Experiment. Grain size of the samples is recorded for all 16 samples before and after RIE treatment. This produces results that can be compared to obtain the effect of RIE on the aluminum film. Results show that RIE affects the mean grain size of the aluminum film as it increases after RIE treatment.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publications (TTP)en_US
dc.subjectAluminiumen_US
dc.subjectGrain sizeen_US
dc.subjectReactive ion etchingen_US
dc.titleAluminium surface grain size analysis on RIE treatmenten_US
dc.typeArticleen_US
dc.contributor.urlzaliman@unimap.edu.myen_US
dc.contributor.urlvc.sundress@gmail.comen_US
dc.contributor.urlfairul@unimap.edu.myen_US
dc.contributor.urlphaklen@unimap.edu.myen_US


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