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Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process

dc.contributor.authorMohd Khairuddin, Md Arshad
dc.contributor.authorAzman, Jalar
dc.contributor.authorIbrahim, Ahmad
dc.date.accessioned2008-12-22T03:09:16Z
dc.date.available2008-12-22T03:09:16Z
dc.date.issued2007
dc.identifier.citationMicroelectronics Reliability, vol.47, 2007, pages 1120-11126.en_US
dc.identifier.urihttp://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6V47-4M1D0KK-1&_user=1659113&_coverDate=07%2F31%2F2007&_rdoc=1&_fmt=high&_orig=search&_origin=search&_sort=d&_docanchor=&view=c&_searchStrId=1553672756&_rerunOrigin=google&_acct=C000054070&_version=1&_urlVersion=0&_userid=1659113&md5=1fb77f161a6870e88296f8e356e66bb0&searchtype=a
dc.identifier.urihttp://www.elsevier.com/
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/3503
dc.descriptionLink to publisher's homepage at www.elsevier.com/locate/microrelen_US
dc.language.isoenen_US
dc.publisherElsevier Scienceen_US
dc.subjectElectroless nickel immersion gold (ENIG)en_US
dc.subjectElectroless platingen_US
dc.subjectMetal coatingen_US
dc.subjectParasitic depositionen_US
dc.subjectElectroless depositionen_US
dc.titleCharacterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold processen_US
dc.typeArticleen_US


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