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| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder | 237 |
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| May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | October 2025 | November 2025 | |
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| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder | 1 | 6 | 8 | 12 | 41 | 5 | 2 |
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