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dc.contributor.authorNur Athirah, Mat Nawi
dc.contributor.authorA.R. Abdullah
dc.contributor.authorMohd Afendi, Rojan, Dr.
dc.contributor.authorMohd Shukry, Abdul Majid, Dr.
dc.contributor.authorRuslizam, Daud, Dr.
dc.contributor.authorHaftirman, Idrus, Dr.
dc.date.accessioned2014-05-08T08:16:51Z
dc.date.available2014-05-08T08:16:51Z
dc.date.issued2014
dc.identifier.citationKey Engineering Materials, vol.594-595, 2014, pages 930-934en_US
dc.identifier.issn1662-9795
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34371
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractA two-dimensional adhesively bonded dissimilar single lap joint model was analyzed under tension. An explicit closed-form solution was formulated by using MATLAB tool for analysis of shear and peel stresses distribution along the bondline under effect of variation of overlap length, adherend thickness ratio and adherend Youngs modulus ratio. The solution was formulated based on analysis of Bo Zhao et al. [2]. The bending moment at the edge joint of the Bo Zhaos solution was replaced by the bending moment at the edge joint that have been proposed by X. Zhao et al. [5] to compare the accuracy of solutions. The least stress intensities in dissimilar joint could be achieved with a suitable ratio of thickness and Youngs modulus of adherends.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectAdhesiveen_US
dc.subjectClosed-Formen_US
dc.subjectDissimilar jointen_US
dc.subjectFinite Element Method (FEM)en_US
dc.subjectSingle lapen_US
dc.titleNumerical stress analysis of epoxy adhesively bonded dissimilar jointen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/KEM.594-595.930
dc.identifier.doi10.4028/www.scientific.net/KEM.594-595.930
dc.contributor.urlnurathirah_matnawi@gmail.comen_US


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