Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.: Recent submissions
Now showing items 21-40 of 43
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The effect of different alkaline treatment condition on flexural properties of kenaf bast- unsaturated polyester composite
(Trans Tech Publications, 2013)The biocomposites were prepared by using kenaf bast fiber mat as reinforcing materials at different percentage. The kenaf bast fiber was treated with alkaline at different sodium hydroxide (NaOH) percentage. From the results ... -
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
(Syscom 18 SRL, 2013-07)The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ... -
The effect of different sizes "Batu Reput" (Dolomite) as a filler in SMR L and ENR-50
(Trans Tech Publications, 2013)The effects of different sizes of "Batu Reput" (Dolomite) filler which are smaller size (<63μm) and bigger size (75-150μm) on tensile and morphological properties of "Batu Reput" (Dolomite) filled SMR L and epoxidized ... -
Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
(Trans Tech Publications, 2013)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its ... -
Microstructure studies on different types of Geopolymer materials
(Trans Tech Publications, 2013)Geopolymer is a new binding material produced to substitute the ordinary Portland cement (OPC) function as a binder in concrete. As we know, different types of geopolymer will have different properties. In this research, ... -
Zn-Sn based high temperature solder - A short review
(Trans Tech Publications, 2013)The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ... -
Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder
(Trans Tech Publications, 2013)Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 ... -
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
(Trans Tech Publications, 2013)To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. ... -
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
(Trans Tech Publications, 2013)Varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminium beverage cans were successfully reincorporated into Sn-0.7Cu base matrix solder material via powder metallurgy ... -
Metallurgical failure analysis of a closed recirculation system water cooling pipe
(Trans Tech Publications, 2013)Catastrophic failure is often associated with a large temperature rise. This situation may lead to a drastic deterioration in material strength where a cooling system is important for a smooth system plant operation to ... -
High temperature creep and hydrogen embrittlement failure of a steam trap bypass tube
(Trans Tech Publications, 2013)A coal fired power plant with its normal operation temperature of 540°C in which its steam trap bypass tube in that power plant was totally fractured. The aim of this study is to explore the evidence related to the steam ... -
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
(Trans Tech Publications, 2014)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ... -
Compressive strength and morphology of fly ash based geopolymer as artificial aggregate with different curing temperature
(Trans Tech Publications, 2014)This paper presented the compressive strength of geopolymer paste with different NaOH concentration and morphology analysis for sintered artificial aggregate. This artificial aggregate was produce based on mix design with ... -
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
(Trans Tech Publications, 2014)The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, ... -
Natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) ternary blend: Curing characteristics and swelling test
(Trans Tech Publications, 2014)Curing characteristics and swelling behavior of natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) blends were investigated. Eleven composition ratio; 50/50/0, 50/40/10, 50/30/20, 50/20/30, ... -
Preparation of cyciopentyi trisiianoi siisesquioxanes - modified natural rubber (CpSSQ(OH)3 - ENR-50) composite hybrid in the presence of HCI acid
(Trans Tech Publications, 2013)A composite comprising cyclopentyl trisilanol siisesquioxanes (CpSSQ(OH)3) and 50% epoxidized natural rubber (ENR-50) was prepared at reflux temperature employed hydrochloric acid (HCl) as catalyst. HCl was found to be an ... -
Synthesis and characterization of electroless copper coated SiC particles
(Trans Tech Publications, 2013)Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp ... -
Overview of pathogenic micro-organisms destruction in contaminated water by oxide photocatalysis
(Trans Tech Publications, 2013)The titanium dioxide (TiO2) is a semiconductor oxide photocatalys, which is chemically and biologically inert but exhibits excellent photolytic activity in the ultraviolet (UV) region. Progress in photocatalytic water ... -
Strength of concrete based cement using recycle ceramic waste as aggregate
(Trans Tech Publications, 2013)The main focus of this research is to study the strength of concrete with ceramic waste as coarse aggregate. The sources of ceramic waste are obtained from the industrial in Malaysia. Presently, in ceramics industries the ... -
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
(Scientific.Net, 2012-12)Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ...