Now showing items 41-42 of 42

    • Research advances of composite solder material fabricated via powder metallurgy route 

      Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...
    • Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method 

      Iziana, Yahya; Noor Asikin, Ab Ghani; Mohd Arif Anuar, Mohd Salleh; Hamidi, Abd Hamid; Zainal Arifin, Ahmad; Mayappan, Ramani (Scientific.Net, 2012-04-12)
      The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many ...