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dc.contributor.authorMohd. Nasir, Mat Saad
dc.contributor.authorKhairul Azwan, Ismail
dc.contributor.authorShayfull Zamree, Abd Rahim
dc.contributor.authorNorshah Afizi, Shuaib
dc.date.accessioned2014-04-23T04:47:05Z
dc.date.available2014-04-23T04:47:05Z
dc.date.issued2013-12
dc.identifier.citationKey Engineering Materials, vol.594-595, 2013, pages 842-851en_US
dc.identifier.issn1662-9795
dc.identifier.urihttp://www.scientific.net/KEM.594-595.842
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33944
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractIn this study, a mold is designed in single and dual type of gate in order to investigate the deflection of warpage for thick component in injection molding process. Autodesk Moldflow Insight software was used as a medium for experimental tested. Nessei NEX 1000 injection molding machine and P20 mold material details were entered in this study to get more accurate data on top of Acrylonitrile Butadiene Styrene (ABS) as a molded thermoplastic material. Taguchi orthogonal array, analysis of Signal to Noise (S/N) ratio and Analysis of Variance (ANOVA) were implemented to get the best combination of parameter and significant factor that affect the warpage problem for both types of gates. Coolant inlet temperature, melt temperature, packing pressure and packing time are the selected parameter that used in this study. A conformation test is conducted to verify the combination parameters optimized. From the result, multi gates used was founded that can decrease the deflection of warpage for thick product. From ANOVA, the most significant factor is melt temperature for single gate, and coolant inlet temperature for multi gate. Packing pressure and packing time were slightly influence on warpage problem for both studies.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectAnalysis of Variance (ANOVA)en_US
dc.subjectInjection moldingen_US
dc.subjectMulti gatesen_US
dc.subjectTaguchien_US
dc.subjectWarpageen_US
dc.titleComparison between single and multi gates for minimization of warpage using taguchi method in injection molding process for ABS materialen_US
dc.typeArticleen_US
dc.identifier.doi10.4028/www.scientific.net/KEM.594-595.842
dc.contributor.urlnasirsaad@unimap.edu.myen_US
dc.contributor.urlk.azwan@unimap.edu.myen_US
dc.contributor.urlnorshahafizi@unimap.edu.myen_US
dc.contributor.urlshayfull@unimap.edu.myen_US


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