Browsing Center of Excellence for Geopolymer and Green Technology (CEGEOGTECH) (Articles) by Author "Norainiza, Saud"
Now showing items 1-3 of 3
-
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste
Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul, Izwan Ramli; Norhayanti, Mohd Nasir; Norainiza, Saud (Trans Tech Publications Ltd., 2016-07)This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste ... -
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
Norainiza, Saud; Najib Saedi, Ibrahim; Mohd Arif Anuar, Mohd Salleh (Trans Tech Publications, 2014)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ... -
Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder
Mohd Izrul, Izwan Ramli; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; R.M. Said; Norhayanti, Mohd Nasir; Norainiza, Saud (Trans Tech Publications Ltd., 2016-07)The wettability and mechanical properties of solder the joint of Sn-Cu-Ni-xSi3N4 had been investigated. In this study, five different silicon nitride (Si3N4) percentage addition were chosen (0 wt. %, 0.25 wt. %, 0.5 wt. ...