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    Wettability and shear strength of Sn-Cu-Ni-xSi3N4 composite solder

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    Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4.pdf (178.8Kb)
    Date
    2016-07
    Author
    Mohd Izrul, Izwan Ramli
    Mohd Arif Anuar, Mohd Salleh
    Mohd Nazree, Derman
    R.M. Said
    Norhayanti, Mohd Nasir
    Norainiza, Saud
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    Abstract
    The wettability and mechanical properties of solder the joint of Sn-Cu-Ni-xSi3N4 had been investigated. In this study, five different silicon nitride (Si3N4) percentage addition were chosen (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %). Contact angle measurement demonstrated that with Si3N4 addition, the wetting perfomances had been improved with the decrease of wettability contact angle. It is believed that the Si3N4 particles suppresses the interfacial IMC growth and thus improves the shear strength. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of Si3N4), the higher the shear strength of the joint. Fracture surface of sheared samples shows a combination of both brittle and ductile fracture.
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    http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63577
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    • Center of Excellence for Geopolymer and Green Technology (CEGEOGTECH) (Articles) [130]

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