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| Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package | 68 |
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| January 2024 | February 2024 | March 2024 | April 2024 | May 2024 | June 2024 | July 2024 | |
|---|---|---|---|---|---|---|---|
| Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package | 6 | 3 | 0 | 2 | 3 | 6 | 0 |
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| Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package.pdf | 23 |
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