Statistics
Total Visits
| Views | |
|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging | 200 |
Total Visits Per Month
| May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | October 2025 | November 2025 | |
|---|---|---|---|---|---|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging | 3 | 6 | 3 | 3 | 2 | 5 | 2 |
File Visits
| Views | |
|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging.pdf | 6 |
Top country views
| Views | |
|---|---|
| United States | 97 |
| China | 13 |
| Finland | 12 |
| Russia | 12 |
| Germany | 10 |
| Ireland | 8 |
| Singapore | 6 |
| Brazil | 5 |
| Malaysia | 5 |
| Sweden | 5 |
Top cities views
| Views | |
|---|---|
| Mountain View | 20 |
| San Mateo | 18 |
| Dublin | 8 |
| Boardman | 6 |
| Ashburn | 3 |
| Hanoi | 3 |
| Kuala Lumpur | 3 |
| Singapore | 3 |
| Chicago | 2 |
| Mersin | 2 |