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dc.contributor.authorAzmi, Kamardin
dc.contributor.authorMohd Nazree, Derman, Dr.
dc.contributor.authorMohd Mustafa Al-Bakri, Abdullah
dc.contributor.authorSandu, A.V.
dc.date.accessioned2014-03-13T08:42:49Z
dc.date.available2014-03-13T08:42:49Z
dc.date.issued2014-01
dc.identifier.citationKey Engineering Materials, vol.594-595, 2014, pages 857-861en_US
dc.identifier.issn1662-9795
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/32671
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThe introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates and optical fibers. Among these advanced packaging materials, silicon carbide particles reinforced copper matrix (Cu-SiCp) composites are highly rated due to the high thermal conductivity of copper and low coefficient of thermal expansion (CTE) of silicon carbide. However, the Cu-SiCp composites fabricated via the conventional powder metallurgy (PM) technique usually have immature thermophysical properties due to the weak bonding between the copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were coated with copper via electroless coating process prior to PM fabrication processes. Based on the experimental results, The CTE and porosity of the Cu-SiCp composites were significantly affected by the volume fraction of SiCp. Furthermore, the CTE and porosity of the Cu-Coated Cu-SiCp composites were significantly lower than the non-Coated Cu-SiCp composites. These differences were mainly contributed by the nature of the bonding between the copper matrix and SiCp reinforcement.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectCopper matrix compositesen_US
dc.subjectElectroless copperen_US
dc.subjectSilicon carbide particlesen_US
dc.subjectThermal expansionen_US
dc.titleThermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical techniqueen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/KEM.594-595.857
dc.contributor.urlazmikamardin@unimap.edu.myen_US


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