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Now showing items 11-20 of 24
Measurements and analysis of a probe-fed circularly polarized loop antenna printed on a layered dielectric sphere
(Institute of Electrical and Electronics Engineers, 2012-04)
Radiation characteristics of a probe-fed open circular loop antenna are presented when the antenna isprinted on a layered dielectric sphere. A smaller parasitic circular loop has been incorporated in the configuration to ...
Silica microchannel fabrication using fluorine based rie with alas a mask
(INSInet Publications, 2012-09)
The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...
Design, simulation and characterization of moly permalloy based electromagnetic sensor
(Trans Tech Publications, Switzerland., 2012)
In this paper it is shown the design, simulation and characterization of Moly Permalloy based electromagnetic sensor in MEMS software. The dimension of the device is minimized to the smallest the software can simulate which ...
Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)
Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...
Shear ram height investigation for gold wire bond shear test
(Trans Tech Publications, 2012-12)
This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...
Wire bond shear test simulation on hemispherical surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...
Improved particle swarm optimization (PSO) for performance optimization of electronic filter circuit designs
(Trans Tech Publications, Switzerland., 2012)
This article discusses and analyzes particle swarm optimization (PSO) approach in the design and performance optimization of a 4th-order Sallen Key high pass filter. Three types of particle swarm features are studied: basic ...
On the electronic nature of silicon and germanium based oxynitrides and their related mechanical, optical and vibrational properties as obtained from DFT and DFPT
(Elsevier B.V., 2012-02)
Electronic structure, bonding and optical properties of the orthorhombic oxynitrides Si2N2O and Ge2N2O
are studied using the density function theory as implemented in pseudo-potential plane wave and fullpotential
(linearized) ...
A comparative study of wavelet families for classification of wrist motions
(Elsevier Ltd., 2012-11)
The selection of most suitable mother wavelet function is still an open research problem in various signal and image processing applications. This paper presents a comparative study of different wavelet families (Daubechies, ...