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Shear ram speed characterization for copper wire bond shear test
(Trans Tech Publications, Switzerland., 2012)
This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...
Silica microchannel fabrication using fluorine based rie with alas a mask
(INSInet Publications, 2012-09)
The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...
Design, simulation and characterization of moly permalloy based electromagnetic sensor
(Trans Tech Publications, Switzerland., 2012)
In this paper it is shown the design, simulation and characterization of Moly Permalloy based electromagnetic sensor in MEMS software. The dimension of the device is minimized to the smallest the software can simulate which ...
Wire bond shear test simulation on hemispherical surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...