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Shear ram speed characterization for copper wire bond shear test
(Trans Tech Publications, Switzerland., 2012)
This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...
Wire bond shear test simulation on hemispherical surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...