Search
Now showing items 1-6 of 6
WSS investigation in microfluidic FFS channel at Re 500
(Trans Tech Publications, 2014-01)
Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...
Velocity profile investigation of FFS microchannel at Re 100
(Trans Tech Publications, 2014)
Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different ...
Shear ram speed characterization for copper wire bond shear test
(Trans Tech Publications, Switzerland., 2012)
This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...
Silica microchannel fabrication using fluorine based rie with alas a mask
(INSInet Publications, 2012-09)
The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...
Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...
Shear ram height investigation for gold wire bond shear test
(Trans Tech Publications, 2012-12)
This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...